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| NP383 Series (Open Top) Chip Scale Package -TH Specifications 1,000M min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: -40C to +150C 10gf per pin approx. Contact Force: 2.2kg 0.5 Operating Force: (CSP, 0.50mm Pitch) Part Number (Details) NP383 - *** Series No. No. of Contact Pins Design Number 09 * Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyetherssulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features Open top socket for BGA Through hole 0.5mm pitch 2-point Tweezer Contacts Positioning Pin: N = Without P = With Example Socket Dimensions Contact Details Recommended PC Board Layout Top View from Socket 2-point Tweezer Style Contact Free Open Test Part Number NP383-18010-* NP383-28804-* NP383-84107-* Grid Size 10x18 18x18 29x29 Body size 11.0x12.5 10.0x10.0 15.0x15.0 Socket Dimensions 19.5x26.0 36.0x36.0 33.0x33 Centre Grid size no grid centre 6x6 7x7 Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Arrays |
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